carbon immersion gold hdiboard
layer: 6 Layer
material: FR4
copper: 1.5oz
surface:Carbon+immersion gold
carbon immersion gold hdiboard
layer: 6 Layer
material: FR4
copper: 1.5oz
surface:Carbon+immersion gold
why choose us:
JSD Circuit--The leading Prototype,Small-volume,Superior Difficulty,High Precision,PCB in China And we have good service---Faster and delivery on time ,and Quick response, reply within 1 hours ,We offer 24×7 hours quotation service and engineering support!
Features: High wiring density, light weight, thin thickness, bending is good!
1:best raw materials
High TG、 FR4、 high frequency(Rogers,Teflon, ARLON, TYCONIC), Halogen-free
2:quick turn service
2 layer 24/H
4-8 layer 48/H
3:Advanced technology
min/T/G:3/3 mil
Impedance control ±10%
MAX aspect ratio for board thickness vs drill bit size 15:1
surface treatment :HASL, Gold plating, Immersuin gold, Immersuin tin, Immersion silver, Gold fingers, OSP
4：Advanced equipment
C Sun big exposure machine 、Etchiing line
5：Engineer Team
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